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MG Chemicals 8329TFF Adhesivo Termoconductor Rápido

MG Chemicals 8329TFF – Adhesivo Termoconductor Rápido

Boost the performance of your electronic assemblies with our MG Chemicals 8329TFF – Fast-Curing and Fluidizable Thermoconductive Adhesive. This fast-curing, thermally conductive adhesive, with its unique ability to conduct heat while electrically insulating, offers an innovative solution to improve the efficiency of your electronic components. Its special formula allows it to adhere firmly to metals, ceramics, glass and most plastics in electronic assemblies. In addition, its resistance to humidity and other corrosive elements positions it as the adhesive of choice for demanding applications. Benefit from a robust, secure and highly effective solution. Optimize your processes with MG Chemicals 8329TFF today!

MG Chemicals 8329TFF – Adhesivo Termoconductor Rápido

Product description

MG Chemicals 8329TFF Fast Curing Thermal Conductive Adhesive is a specialized adhesive that stands out for its thermal and electrical properties. This adhesive is a mixture of equal parts of two components (1-1 system) that hardens quickly, with a setting time of only 15 minutes. It comes in the form of a soft white paste that, once cured, forms a hard and durable polymer.

Distinguishable Properties

Thermal Conductivity: The adhesive stands out for its ability to conduct heat, with a thermal conductivity of 0.8 W/(m·K). This feature is essential in applications where heat control is critical.

Flame Resistance: This product is registered under the UL 94V-0 standard, which certifies its resistance to fire (UL File# E334302). This property makes it especially safe for use in electronic assemblies.

Resistant and Durable: In addition to its hardness, the adhesive offers high resistance to humidity, salt water, soft bases and aliphatic hydrocarbons. It also has a low Coefficient Thermal Expansion Rate (CTE) before the glass transition (Tg), which favors dimensional stability under temperature changes.

Electrical Insulation: Despite its thermal conductivity, this adhesive provides strong electrical insulation, making it ideal for electronics applications.

Applications

  • Heatsink Bonding: This adhesive is frequently used to bond heatsinks to CPUs. It is also useful for gluing heat sinks to LEDs and other electronic components.
  • Assembly of electronic components: Thanks to its flame resistance and electrical insulation, this adhesive is ideal for the assembly of electronic components.
  • Applications that require rapid setting: Given its setting time of only 15 minutes, this adhesive is an excellent option for applications that require rapid drying.

MG Chemicals 8329TFF Fast Curing Thermal Conductive Adhesive is viscous, but fluid enough to be dispensed from a syringe. The 50ml size can be used with a mixing tip when dispensing with a caulking gun or pressurized system.

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